CUED Publications database

Mechanically Guided Post-Assembly of 3D Electronic Systems

Kim, BH and Liu, F and Yu, Y and Jang, H and Xie, Z and Li, K and Lee, J and Jeong, JY and Ryu, A and Lee, Y and Kim, DH and Wang, X and Lee, KH and Lee, JY and Won, SM and Oh, N and Kim, J and Kim, JY and Jeong, SJ and Jang, KI and Lee, S and Huang, Y and Zhang, Y and Rogers, JA (2018) Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28. p. 1803149. ISSN 1616-301X

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Abstract

© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.

Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Materials Engineering
Depositing User: Cron Job
Date Deposited: 13 May 2019 20:06
Last Modified: 24 Nov 2020 12:05
DOI: 10.1002/adfm.201803149