Malhan, RK and Rashid, SJ and Kataoka, M and Takeuchi, Y and Sugiyama, N and Udrea, F and Amaratunga, GAJ and Reimann, T (2009) Switching performance of epitaxially grown normally-off 4H-SiC JFET. Materials Science Forum, 600-60. pp. 1067-1070. ISSN 0255-5476Full text not available from this repository.
Static and dynamic behavior of the epitaxially grown dual gate trench 4H-SiC junction field effect transistor (JFET) is investigated. Typical on-state resistance Ron was 6-10mΩcm2 at VGS = 2.5V and the breakdown voltage between the range of 1.5-1.8kV was realized at VGS = -5V for normally-off like JFETs. It was found that the turn-on energy delivers the biggest part of the switching losses. The dependence of switching losses from gate resistor is nearly linear, suggesting that changing the gate resistor, a way similar to Si-IGBT technology, can easily control di/dt and dv/dt. Turn-on losses at 200°C are lower compared to those at 25°C, which indicates the influence of the high internal p-type gate layer resistance. Inductive switching numerical analysis suggested the strong influence of channel doping conditions on the turn-on switching performance. The fast switching normally-off JFET devices require heavily doped narrow JFET channel design. © (2009) Trans Tech Publications, Switzerland.
|Uncontrolled Keywords:||Dual gate Embedded epitaxy Normally-off JFET SiC Switching Characteristics|
|Depositing User:||Unnamed user with email firstname.lastname@example.org|
|Date Deposited:||16 Jul 2015 13:34|
|Last Modified:||30 Jul 2015 22:34|