Luo, J and He, JH and Flewitt, A and Moore, DF and Spearing, SM and Fleck, NA and Milne, WI (2005) Development of all metal electrothermal actuator and its applications. Journal of Microlithography, Microfabrication and Microsystems, 4. pp. 1-9. ISSN 1537-1646Full text not available from this repository.
The in-plane motion of microelectrothermal actuator ("heatuator") has been analyzed for Si-based and metallic devices. It was found that the lateral deflection of a heatuator made of a Ni metal is about ∼60% larger than that of a Si-based actuator under the same power consumption. Metals are much better for thermal actuators as they provide a relatively large deflection and large force, for a low operating temperature and power consumption. Electroplated Ni films were used to fabricate heatuators. The electrical and mechanical properties of electroplated Ni thin films have been investigated as a function of temperature and plating current density, and the process conditions have been optimized to obtain stress-free films suitable for microelectromechanical systems applications. Lateral thermal actuators have been successfully fabricated, and electrically tested. Microswitches and microtweezers utilizing the heatuator have also been fabricated and tested. © 2005 Society of Photo-Optical Instrumentation Engineers.
|Uncontrolled Keywords:||Electroplating Electrothermal actuator Finite element analysis Heatuator Metal thermal actuator Microswitch Microtweezers Ni|
|Divisions:||Div C > Materials Engineering|
Div B > Solid State Electronics and Nanoscale Science
|Depositing User:||Cron Job|
|Date Deposited:||07 Mar 2014 11:53|
|Last Modified:||08 Dec 2014 02:36|