UNSPECIFIED Semiconductor device provided by silicon carbide substrate and method for manufacturing the same. doi:.
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| Item Type: | Patent |
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| Additional Information: | Applicant was = Denso Corp (JP) Also published as: US7154130 (B2), US2005006716 (A1), JP2004247496 (A), DE102004006537 (A1) |
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| Subjects: | UNSPECIFIED |
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| Divisions: | Div B > Electronics, Power & Energy Conversion |
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| Depositing User: | Cron Job |
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| Date Deposited: | 28 Oct 2011 17:04 |
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| Last Modified: | 16 Nov 2011 19:00 |
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| DOI: | |
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