CUED Publications database

Analysis of novel packaging techniques for high power electronics in SiC

Rashid, SJ and Johnson, CM and Udrea, F and Mihalia, A and Amaratunga, GAJ and Malhan, RK (2005) Analysis of novel packaging techniques for high power electronics in SiC. In: 6th European Conference on Silicon Carbide and Related Materials (ECSCRM'06), 2005-9-3 to 2005-9-7, Newcastle uon Tyne, UK pp. 971-974..

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Item Type: Conference or Workshop Item (UNSPECIFIED)
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Depositing User: Unnamed user with email sms67@cam.ac.uk
Date Deposited: 16 Jul 2015 14:28
Last Modified: 28 Aug 2015 22:32
DOI: