CUED Publications database

Analysis of novel packaging techniques for high power electronics in SiC

Rashid, SJ and Johnson, CM and Udrea, F and Mihalia, A and Amaratunga, GAJ and Malhan, RK (2005) Analysis of novel packaging techniques for high power electronics in SiC. In: 6th European Conference on Silicon Carbide and Related Materials (ECSCRM'06), 2005-9-3 to 2005-9-7, Newcastle uon Tyne, UK pp. 971-974..

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Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: UNSPECIFIED
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Depositing User: Cron job
Date Deposited: 04 Feb 2015 23:25
Last Modified: 05 Feb 2015 01:45
DOI: