CUED Publications database

Analysis of novel packaging techniques for high power electronics in SiC

Rashid, SJ and Johnson, CM and Udrea, F and Mihalia, A and Amaratunga, GAJ and Malhan, RK (2005) Analysis of novel packaging techniques for high power electronics in SiC. In: 6th European Conference on Silicon Carbide and Related Materials (ECSCRM'06), 2005-9-3 to 2005-9-7, Newcastle uon Tyne, UK pp. 971-974..

Full text not available from this repository.
Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: UNSPECIFIED
Divisions: Div B > Electronics, Power & Energy Conversion
Depositing User: Cron Job
Date Deposited: 15 Dec 2015 13:55
Last Modified: 12 Feb 2016 03:08
DOI: