CUED Publications database

Modelling of delamination of ultra low-k material during chemical mechanical polishing

Liu, F and Sutcliffe, MPF (2007) Modelling of delamination of ultra low-k material during chemical mechanical polishing. Tribology Letters, 25. pp. 225-236. ISSN 1023-8883

Full text not available from this repository.
Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Biomechanics
Depositing User: Cron Job
Date Deposited: 15 Dec 2015 13:25
Last Modified: 08 Feb 2016 10:11
DOI: 10.1007/s11249-006-9171-z