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Modelling of delamination of ultra low-k material during chemical mechanical polishing

Liu, F and Sutcliffe, MPF (2007) Modelling of delamination of ultra low-k material during chemical mechanical polishing. Tribology Letters, 25. pp. 225-236. ISSN 1023-8883

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Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Biomechanics
Depositing User: Cron Job
Date Deposited: 07 Mar 2014 11:39
Last Modified: 17 Mar 2014 14:33
DOI: 10.1007/s11249-006-9171-z

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