CUED Publications database

Modelling of delamination of ultra low-k material during chemical mechanical polishing

Liu, F and Sutcliffe, MPF (2007) Modelling of delamination of ultra low-k material during chemical mechanical polishing. Tribology Letters, 25. pp. 225-236. ISSN 1023-8883

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Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Biomechanics
Depositing User: Cron Job
Date Deposited: 18 May 2016 18:44
Last Modified: 25 Aug 2016 10:53
DOI: