CUED Publications database

Modelling of delamination of ultra low-k material during chemical mechanical polishing

Liu, F and Sutcliffe, MPF (2007) Modelling of delamination of ultra low-k material during chemical mechanical polishing. Tribology Letters, 25. pp. 225-236. ISSN 1023-8883

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Item Type: Article
Subjects: UNSPECIFIED
Divisions: UNSPECIFIED
Depositing User: Cron job
Date Deposited: 04 Feb 2015 22:04
Last Modified: 01 May 2015 19:03
DOI: 10.1007/s11249-006-9171-z