CUED Publications database

Analysis of wafer stresses during millisecond thermal processing

Smith, MP and Seffen, KA and McMahon, RA and Voelskow, M and Skorupa, W (2006) Analysis of wafer stresses during millisecond thermal processing. Journal of Applied Physics, 100. 063515-. ISSN 0021-8979

Full text not available from this repository.
Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div D > Structures
Depositing User: Unnamed user with email sms67@cam.ac.uk
Date Deposited: 16 Jul 2015 13:47
Last Modified: 29 Aug 2015 21:56
DOI: