Johnson, CM and Buttay, C and Rashid, SJ and Udrea, F and Amaratunga, GAJ and Ireland, P and Malhan, RK (2007) Compact double-side liquid-impingement-cooled integrated power electronic module. Proceedings of the International Symposium on Power Semiconductor Devices and ICs. pp. 53-56. ISSN 1063-6854Full text not available from this repository.
This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.
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|Date Deposited:||04 Feb 2015 22:48|
|Last Modified:||05 Feb 2015 01:04|