Nachum, S and Fleck, NA and Ashby, MF and Colella, A and Matteazzi, P (2010) The microstructural basis for the mechanical properties and electrical resistivity of nanocrystalline Cu-Al2O3. MAT SCI ENG A-STRUCT, 527. pp. 5065-5071. ISSN 0921-5093
Full text not available from this repository.
| Item Type: | Article |
| Uncontrolled Keywords: | Nanocrystalline alloys Electrical resistivity Dispersion strengthening Shear bands Nano-indentation STRAIN GRADIENT PLASTICITY SHEAR BANDS COPPER INDENTATION SIZE BEHAVIOR CU FE NANOCOMPOSITE DEFORMATION |
| Subjects: | UNSPECIFIED |
| Divisions: | Div C > Materials Engineering |
| Depositing User: | Cron Job |
| Date Deposited: | 21 Jan 2012 14:10 |
| Last Modified: | 20 May 2013 01:31 |
| DOI: | 10.1016/j.msea.2010.04.070 |
|---|
Actions (login required)