Ferri, M and Mancarella, F and Seshia, A and Ransley, J and Soga, K and Zalesky, J and Roncaglia, A (2010) Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures. SMART STRUCTURES AND SYSTEMS, 6. pp. 225-238. ISSN 1738-1584Full text not available from this repository.
|Uncontrolled Keywords:||structural monitoring cracks MEMS wireless SILICON|
|Divisions:||Div D > Geotechnical and Environmental|
|Depositing User:||Unnamed user with email email@example.com|
|Date Deposited:||16 Jul 2015 13:34|
|Last Modified:||29 Nov 2015 08:10|