CUED Publications database

Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Ferri, M and Mancarella, F and Seshia, A and Ransley, J and Soga, K and Zalesky, J and Roncaglia, A (2010) Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures. SMART STRUCTURES AND SYSTEMS, 6. pp. 225-238. ISSN 1738-1584

Full text not available from this repository.
Item Type: Article
Uncontrolled Keywords: structural monitoring cracks MEMS wireless SILICON
Subjects: UNSPECIFIED
Divisions: Div D > Geotechnical and Environmental
Depositing User: Cron Job
Date Deposited: 07 Mar 2014 11:49
Last Modified: 08 Dec 2014 02:22
DOI: