Hasko, DG and McMahon, RA and Ahmed, H and Stobbs, WM and Godfrey, DJ (1985) RESIDUAL DEFECTS FOLLOWING RAPID ANNEALING OF BORON IMPLANTED SILICON WITH AND WITHOUT PREAMORPHISATION BY SILICON IMPLANTATION. Institute of Physics Conference Series. pp. 99-104. ISSN 0373-0751Full text not available from this repository.
Implants of boron into silicon which has been made amorphous by silicon implantation have a shallower depth profile than the same implants into silicon. This results in higher activation and restricted diffusion of the B implants after annealing, and there are also significant differences in the microstructure after annealing compared with B implants into silicon. Rapid isothermal heating with an electron beam and furnace treatments are used to characterize the defect structure as a function of time and temperature. Defects are seen to influence the diffusion of non-substitutional boron.
|Divisions:||Div B > Electronics, Power & Energy Conversion|
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|Date Deposited:||18 May 2016 19:05|
|Last Modified:||27 Aug 2016 00:16|