Dunne, B and O'Flanagan, S and Hobbs, L and Cahill, CG and Mathewson, A and Lane, WA and Montier, M and Chapuis, D and Gris, Y and Karapiperis, L and Garry, G and Dieumegard, D and Regolini, JL and Bensahel, D and Mermet, JL and Bono, H and Achard, H and Joly, JP and Barfoot, KM and Field, M and Hopper, GF and Godfrey, DJ and Timans, PJ and Smith, D and Williams, DA and McMahon, RA and Ahmed, H (1988) Materials and devices toward three-dimensional integration. Microelectronic Engineering, 8. pp. 235-253. ISSN 0167-9317
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