Holburn, DM and Anstey, M and Jordan, DS and Hawkins, CE (1995) Novel architecture to facilitate disassembly and reuse of electronic components and sub-assemblies. IEE Conference Publication. pp. 214-217. ISSN 0537-9989Full text not available from this repository.
This paper advances the proposition that in many electronic products, the partitioning scheme adopted and the interconnection system used to interconnect the sub-assemblies or components are intimately related to the economic benefits, and hence the attractiveness, of reuse of these items. An architecture has been developed in which the residual values of the connectors, components and sub-assemblies are maximized, and opportunities for take-back and reuse of redundant items are greatly enhanced. The system described also offers significant manufacturing cost benefits in terms of ease of assembly, compactness and robustness.
|Divisions:||Div B > Solid State Electronics and Nanoscale Science|
|Depositing User:||Cron Job|
|Date Deposited:||07 Mar 2014 12:39|
|Last Modified:||27 Nov 2014 19:24|