Oda, S and Moore, DF and Milne, WI (1999) Nanostructuring of materials for device and sensor applications. Engineering Science and Education Journal, 8. pp. 281-285. ISSN 0963-7346Full text not available from this repository.
The recent developments in nanotechnology are reviewed, with particular emphasis on its application in microsystem technology where increased reliability is achieved by integrating the sensor and the readout electronics on the same substrate. New applications may be possible using integrated micromechanical clips to connect optic fibers and components in integrated silicon systems. Some of the key developments in enabling technologies are also described, including the control of thin film deposition, nanostructuring to tailor the properties of thin film, silicon micromachining to make sensors, and microclips for the low-cost assembly of integrated optical microsystems.
|Divisions:||Div B > Solid State Electronics and Nanoscale Science|
|Depositing User:||Unnamed user with email email@example.com|
|Date Deposited:||15 Dec 2015 12:46|
|Last Modified:||04 May 2016 00:57|