Du, B and Hudgins, JL and Santi, E and Bryant, AT and Palmer, PR and Mantooth, HA (2008) Transient thermal analysis of power devices based on Fourier-series thermal model. In: UNSPECIFIED pp. 3129-3135..Full text not available from this repository.
A new thermal model based on Fourier series expansion method has been presented for dynamic thermal analysis on power devices. The thermal model based on the Fourier series method has been programmed in MATLAB SIMULINK and integrated with a physics-based electrical model previously reported. The model was verified for accuracy using a two-dimensional Fourier model and a two-dimensional finite difference model for comparison. To validate this thermal model, experiments using a 600V 50A IGBT module switching an inductive load, has been completed under high frequency operation. The result of the thermal measurement shows an excellent match with the simulated temperature variations and temperature time-response within the power module. ©2008 IEEE.
|Item Type:||Conference or Workshop Item (UNSPECIFIED)|
|Uncontrolled Keywords:||Electro-thermal simulation Fourier-series thermal models Packaging Transient thermal analysis|
|Depositing User:||Cron job|
|Date Deposited:||16 Jul 2015 14:04|
|Last Modified:||03 Aug 2015 09:01|