CUED Publications database

A packaging technique for silicon MEMS strain sensors on steel

Ferri, M and Cristiani, S and Roncaglia, A and Kobayashi, Y and Soga, K (2008) A packaging technique for silicon MEMS strain sensors on steel. In: UNSPECIFIED pp. 1524-1527..

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Abstract

A packaging technique suited to applying MEMS strain sensors realized on a silicon chip to a steel flat surface is described. The method is based on adhesive bonding of the silicon chip rear surface on steel using two types of glue normally used for standard piezoresistive strain sensors (Mbond200/ 600), using direct wire bonding of the chip to a Printed Circuit Board, also fixed on steel. In order to protect the sensor from the external environment, and to improve the MEMS performance, the silicon chip is encapsulated with a metal cap hermetically sealed-off under vacuum condition with a vacuum adhesive in which the bonding wires are also protected from possible damage. In order to evaluate the mechanical coupling of the silicon chip with the bar and thestress transfer extent to the silicon surface, commercial strain sensors have been applied on the chip glued on a steel bar in alaboratory setup able to generate strain by inflection, yielding a stress transfer around 70% from steel to silicon. © 2008 IEEE.

Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: UNSPECIFIED
Divisions: Div D > Geotechnical and Environmental
Depositing User: Cron Job
Date Deposited: 07 Mar 2014 12:32
Last Modified: 30 Nov 2014 15:45
DOI: 10.1109/ICSENS.2008.4716737