Haneef, I and Burzo, M and Ali, SZ and Komarov, P and Udrea, F and Raad, PE (2010) Thermal characterization of SOI CMOS micro hot-plate gas sensors. 16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010. pp. 101-104.Full text not available from this repository.
This work reports on thermal characterization of SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) MEMS (micro electro mechanical system) gas sensors using a thermoreflectance (TR) thermography system. The sensors were fabricated in a CMOS foundry and the micro hot-plate structures were created by back-etching the CMOS processed wafers in a MEMS foundry using DRIE (deep reactive ion etch) process. The calibration and experimental details of the thermoreflectance based thermal imaging setup, used for these micro hot-plate gas sensor structures, are presented. Experimentally determined temperature of a micro hot-plate sensor, using TR thermography and built-in silicon resistive temperature sensor, is compared with that estimated using numerical simulations. The results confirm that TR based thermal imaging technique can be used to determine surface temperature of CMOS MEMS devices with a high accuracy. © 2010 EDA Publishing/THERMINIC.
|Divisions:||Div B > Electronics, Power & Energy Conversion|
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|Date Deposited:||09 Dec 2016 18:08|
|Last Modified:||30 Mar 2017 00:53|