Jin, H and Zhou, J and Dong, SR and Feng, B and Luo, JK and Luo, JK and Wang, DM and Milne, WI and Milne, WI and Yang, CY (2012) Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering. Thin Solid Films, 520. pp. 4863-4870. ISSN 0040-6090Full text not available from this repository.
Aluminum nitride (AlN) piezoelectric thin films with c-axis crystal orientation on polymer substrates can potentially be used for development of flexible electronics and lab-on-chip systems. In this study, we investigated the effects of deposition parameters on the crystal structure of AlN thin films on polymer substrates deposited by reactive direct-current magnetron sputtering. The results show that low sputtering pressure as well as optimized N 2/Ar flow ratio and sputtering power is beneficial for AlN (002) orientation and can produce a highly (002) oriented columnar structure on polymer substrates. High sputtering power and low N 2/Ar flow ratio increase the deposition rate. In addition, the thickness of Al underlayer also has a strong influence on the film crystallography. The optimal deposition parameters in our experiments are: deposition pressure 0.38 Pa, N 2/Ar flow ratio 2:3, sputtering power 414 W, and thickness of Al underlayer less than 100 nm. © 2012 Elsevier B.V. All rights reserved.
|Uncontrolled Keywords:||Aluminum nitride c-Axis orientation Polymer substrates Reactive magnetron sputtering Thin films|
|Depositing User:||Cron job|
|Date Deposited:||16 Jul 2015 13:14|
|Last Modified:||01 Aug 2015 02:42|