Li, K and O'Neill, W (2012) Fibre laser microvia drilling and ablation of Si with tuneable pulse shapes. International Journal of Precision Engineering and Manufacturing, 13. pp. 641-648. ISSN 1229-8557Full text not available from this repository.
The dramatic increase in hole quality on single crystalline silicon with an 1 μm fiber laser has been reported recently, it redefines the processing options for Si at that wavelength. This study investigated the effects of the MOPA based pulse tuning on the changes of the machined depth and the mass removal mechanism for the generation of microvia holes. Hole depths were measured and surface morphology studied using SEM and optical interferometric profilometry. The pulse peak power was found to strongly influence the material removal mechanism with fixed pulse duration. High peak powers (>1 kW) gave vaporization dominated ablation, left a limited re solidified molten layer and clean hole formation. The pulse duration was found to strongly influence the machined depth. Longer pulse durations generated deeper holes with constant peak power (>1 kW). In comparison with the DPSS UV laser, the IR fiber laser of longer pulse durations machined deeper holes and generated less resolidifed melt beyond the hole rim at high fluencies. The comparison suggests that some applications (microvia drilling) of the DPSS UV laser can be replaced with the more flexible, low cost IR fiber laser. © KSPE and Springer 2012.
|Uncontrolled Keywords:||Drilling Fibre laser Pulse profile Silicon|
|Divisions:||Div E > Production Processes|
Div B > Photonics
|Depositing User:||Cron job|
|Date Deposited:||16 Jul 2015 13:49|
|Last Modified:||25 Nov 2015 10:30|