Aristidou, P and Palmer, PR (2012) Towards a fast electro-thermo-mechanical IGBT/Diode simulation framework for design of reliable power electronic converters. 15th International Power Electronics and Motion Control Conference and Exposition, EPE-PEMC 2012 ECCE Europe. DS1a.61-DS1a.68.Full text not available from this repository.
This paper describes a methodology that enables fast and reasonably accurate prediction of the reliability of power electronic modules featuring IGBTs and p-i-n diodes, by taking into account thermo-mechanical failure mechanisms of the devices and their associated packaging. In brief, the proposed simulation framework performs two main tasks which are tightly linked together: (i) the generation of the power devices' transient thermal response for realistic long load cycles and (ii) the prediction of the power modules' lifetime based on the obtained temperature profiles. In doing so the first task employs compact, physics-based device models, power losses lookup tables and polynomials and combined material-failure and thermal modelling, while the second task uses advanced reliability tests for failure mode and time-to-failure estimation. The proposed technique is intended to be utilised as a design/optimisation tool for reliable power electronic converters, since it allows easy and fast investigation of the effects that changes in circuit topology or devices' characteristics and packaging have on the reliability of the employed power electronic modules. © 2012 IEEE.
|Uncontrolled Keywords:||electro-thermal device modelling Reliability thermal cycling|
|Divisions:||Div B > Electronics, Power & Energy Conversion|
|Depositing User:||Cron Job|
|Date Deposited:||07 Mar 2014 12:14|
|Last Modified:||08 Dec 2014 02:27|