CUED Publications database

3D modelling of a thermopile-based SOI CMOS thermal wall shear stress sensor

Falco, C and De Luca, A and Sarfraz, S and Haneef, I and Coull, J and Ali, SZ and Udrea, F (2014) 3D modelling of a thermopile-based SOI CMOS thermal wall shear stress sensor. In: UNSPECIFIED pp. 277-280..

Full text not available from this repository.

Abstract

© 2014 IEEE. This paper presents a multiphysic 3-D model of an SOI CMOS MEMS thermal wall shear stress sensor obtained using 'Comsol Multiphysics'. It includes all the physical domains involved and their interaction. After a brief introduction, the device is presented and its working principle explained. The numerical model and the validation process are then described.

Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: UNSPECIFIED
Divisions: Div B > Electronics, Power & Energy Conversion
Depositing User: Cron Job
Date Deposited: 17 Jul 2017 19:42
Last Modified: 20 Nov 2018 01:45
DOI: