CUED Publications database

The use of buffer pellets to pseudo hot seed (RE)-Ba-Cu-O-(Ag) single grain bulk superconductors

Shi, Y and Kumar Namburi, D and Zhao, W and Durrell, JH and Dennis, AR and Cardwell, DA (2016) The use of buffer pellets to pseudo hot seed (RE)-Ba-Cu-O-(Ag) single grain bulk superconductors. Superconductor Science and Technology, 29. ISSN 0953-2048

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Reliable seeding of the superconducting (RE)Ba 2 Cu 3 O 7-δ (RE-123) phase is a critical step in the melt growth of large, single grain, (RE)BaCuO ((RE)BCO) bulk superconductors. Recent improvements to the top seeded melt growth (TSMG) processing technique, which is an established method of fabricating bulk (RE)BCO superconductors, based on the use of a buffer layer between the seed and green body preform, has significantly improved the reliability of the single grain growth process. This technique has been used successfully for the primary TSMG and infiltration melt growth of all compositions within the ((RE)BCO-Ag) family of materials (where RE = Sm, Gd and Y), and in recycling processes. However, the mechanism behind the improved reliability of the melt process is not understood fully and its effect on the superconducting properties of the fully processed single grains is not clear. In this paper, we investigate the effect of the use of a buffer pellet between the seed and green body on the microstructure, critical current, critical temperature and trapped field of the bulk superconductor. We conclude that the introduction of the buffer pellet evolves the melt growth process towards that observed in the technologically challenging hot seeding technique, but has the potential to yield high quality single grain samples but by a commercially viable melt process.

Item Type: Article
Divisions: Div C > Materials Engineering
Depositing User: Unnamed user with email
Date Deposited: 17 Jul 2017 19:05
Last Modified: 09 Sep 2021 02:52
DOI: 10.1088/0953-2048/29/1/015010