CUED Publications database

Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators

Belsito, L and Ferri, M and Mancarella, F and Masini, L and Yan, J and Seshia, AA and Soga, K and Roncaglia, A (2016) Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators. Sensors and Actuators, A: Physical, 239. pp. 90-101. ISSN 0924-4247

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Abstract

© 2016 Elsevier B.V. All rights reserved. The paper reports on the fabrication and characterization of high-resolution strain sensors for structural materials based on Silicon On Insulator flexural resonators manufactured by polysilicon Low-Pressure Chemical Vapour Deposition vacuum packaging. The sensors present sensitivity of 164 Hz/με and strain resolution limit of 150 pε on steel for a measurement time of 315 ms, in both tensile and compressive strain regimes. The readout of the sensor is implemented with a transimpedance oscillator circuit implemented on Printed Circuit Board, in which a microcontroller-based reciprocal frequency counter is integrated. The performance of the sensors on steel are investigated for measurement bandwidths from 1.5 to 500 Hz and a comparison with conventional metal strain gauges is proposed.

Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Applied Mechanics
Div D > Geotechnical and Environmental
Depositing User: Cron Job
Date Deposited: 17 Jul 2017 19:42
Last Modified: 07 Sep 2017 01:47
DOI: