CUED Publications database

Vacuum Packaged Low-Power Resonant MEMS Strain Sensor

Do, CD and Erbes, A and Yan, J and Soga, K and Seshia, AA (2016) Vacuum Packaged Low-Power Resonant MEMS Strain Sensor. Journal of Microelectromechanical Systems, 25. pp. 851-858. ISSN 1057-7157

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Abstract

© 2016 IEEE. This paper describes a technical approach toward the realization of a low-power temperature-compensated micromachined resonant strain sensor. The sensor design is based on two identical and orthogonally-oriented resonators where the differential frequency is utilized to provide an output proportional to the applied strain with temperature compensation achieved to first order. Interface circuits comprising of two front-end oscillators, a mixer, and low-pass filter are designed and fabricated in a standard 0.35-μm CMOS process. The characterized devices demonstrate a scale factor of 2.8 Hz/μϵ over a strain range of 1000 μϵ with excellent linearity over the measurement range. The compensated frequency drift due to temperature is reduced to 4% of the uncompensated value through this scheme. The total continuous power consumption of the strain sensor is 3 μϵW from a 1.2 V supply. This low power implementation is essential to enable battery-powered or energy harvesting enabled monitoring applications.

Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Applied Mechanics
Depositing User: Cron Job
Date Deposited: 17 Jul 2017 19:34
Last Modified: 07 Sep 2017 01:44
DOI: