CUED Publications database

Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices

Zhang, Z and Pivnenko, M and Medina-Salazar, I and You, Z and Chu, D (2015) Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 230. pp. 1659-1664. ISSN 0954-4054

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Abstract

In this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented ba sed on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.

Item Type: Article
Uncontrolled Keywords: liquid crystal on silicon phase-only die-level assembly liquid crystal filling
Subjects: UNSPECIFIED
Divisions: Div B > Photonics
Depositing User: Cron Job
Date Deposited: 17 Jul 2017 19:36
Last Modified: 25 Feb 2021 06:32
DOI: 10.1177/0954405415578583