CUED Publications database

Low deformation and stress packaging of micro-machined devices

Dickerson, T and Ward, M (1997) Low deformation and stress packaging of micro-machined devices. IEE Colloquium (Digest). ISSN 0963-3308

Full text not available from this repository.
Item Type: Article
Subjects: UNSPECIFIED
Divisions: Div C > Engineering Design
Depositing User: Cron Job
Date Deposited: 17 Jul 2017 19:09
Last Modified: 19 Oct 2017 01:31
DOI: