CUED Publications database

On the application of a numerical model to improve the accuracy of the seebeck coefficient in CMOS materials

Falco, C and Udrea, F (2017) On the application of a numerical model to improve the accuracy of the seebeck coefficient in CMOS materials. In: UNSPECIFIED pp. 1-3..

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Abstract

Thermal sensing faces challenging requirements in terms of power dissipation, sensitivity and selectivity. A key point to achieve higher performance is an increased precision when characterising the material properties within the temperature range of interest, which can then be used to optimise the structure design. The main source of error in thermal sensors, with respect to the thermal properties, is the limited knowledge of the temperature profile inside the structure, based on symmetry considerations or assumptions. In this paper we use a 3D model to accurately describe the temperature profile inside the structure, obtaining more accurate values for the material property of interest. This approach has been applied to a test structure used for extrapolating the Seebeck Coefficient in CMOS materials.

Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: UNSPECIFIED
Divisions: Div B > Electronics, Power & Energy Conversion
Depositing User: Cron Job
Date Deposited: 01 May 2018 02:05
Last Modified: 10 Apr 2021 22:26
DOI: 10.1109/ICSENS.2017.8233900